Metal Bond Diamond Grinding Wheel 120x15x32mm for Silicon Ingot & Quartz Processing – 10mm Segment Height, High-Durability Superabrasive Wheel

Engineered for demanding applications in the solar and semiconductor industries, this metal bond diamond grinding wheel delivers reliable performance in the processing of silicon ingots and quartz components. With a 120mm outer diameter, 15mm width, and 32mm arbor hole, it is compatible with most industrial grinding and cutting systems used for ingot squaring, edge rounding, and surface flattening. The 10mm-high diamond segments are sintered using high-temperature metallurgical bonding, ensuring strong grit retention even under heavy feed rates. Suitable for both wet and dry grinding (wet recommended), this wheel helps achieve consistent geometry, minimal kerf loss, and high throughput—critical for cost-effective wafer production. Max operating speed: typically 35–45 m/s (verify with equipment manual).

• Robust Metal Bond Diamond Construction – Bronze-based metal bond with high diamond concentration ensures exceptional wear resistance and long service life when grinding ultra-hard, brittle materials like monocrystalline silicon and fused quartz.
• Optimized for Photovoltaic & Semiconductor Prep – Specifically designed for silicon ingot squaring, chamfering, and surface conditioning prior to wire saw slicing—minimizes subsurface damage and material loss.
• Precision Dimensions for Stable Operation – 120mm OD × 15mm width × 32mm bore with 10mm segment height fits standard CNC grinders and multi-blade cutting machines; balanced for low vibration at high speeds.
• Excellent Heat Dissipation & Chip Removal – Dense metal matrix provides superior thermal conductivity, reducing workpiece burning; continuous rim or segmented design (as per model) enhances coolant flow and debris clearance.
• Ideal for High-Volume Production Environments – Maintains sharp cutting edges over extended runs, reducing dressing frequency and downtime in solar wafer and quartz component manufacturing.